Thermal Interface Bonding Research

This research area investigates the bonding processes and interface strengths in thermal management applications within electronics. It assesses the impact of chemical bonding on performance.

thermal bonding
interface strength
chemical bonding
thermal management
performance assessment

10,705 papers

Parent topic: Advanced Electronic Packaging Technologies

AI-assisted content · The overview, paper groupings, and influence analysis on this page are AI-generated. They are intended as a starting point for exploring the field and may contain inaccuracies. Report an error

Papers Over Time

19501960197019801990200020102020

Top Papers

Incidence Of White Spot Formation After Bonding And Banding

1982 · 682 citations

Effects Of Chemical Bonding On Heat Transport Across Interfaces

2012 · 603 citations

Temperature And Orientation Dependence Of The Yield Stress In Ni{in3}Ga Single Crystals

1973 · 537 citations

Resonant Bonding Leads To Low Lattice Thermal Conductivity

2014 · 537 citations

Tin–lead (SnPb) Solder Reaction In Flip Chip Technology

2001 · 521 citations

A 45Nm Logic Technology With High-k+Metal Gate Transistors, Strained Silicon, 9 Cu Interconnect Layers, 193Nm Dry Patterning, And 100% Pb-free Packaging

2007 · 440 citations

Kirkendall Void Formation In Eutectic SnPb Solder Joints On Bare Cu And Its Effect On Joint Reliability

2005 · 393 citations

Overview Of Transient Liquid Phase And Partial Transient Liquid Phase Bonding

2011 · 389 citations

Surface Activated Bonding Of Silicon Wafers At Room Temperature

1996 · 387 citations

Die Attach Materials For High Temperature Applications: A Review

2011 · 387 citations

A Review: On The Development Of Low Melting Temperature Pb-free Solders

2014 · 373 citations

Wafer-to-wafer Bonding For Microstructure Formation

1998 · 348 citations

Impurity And Alloying Effects On Interfacial Reaction Layers In Pb-free Soldering

2010 · 309 citations

Low-Temperature Sintering With Nano-Silver Paste In Die-Attached Interconnection

2007 · 301 citations

High-temperature Lead-Free Solders: Properties And Possibilities

2009 · 293 citations

Room Temperature Cu–Cu Direct Bonding Using Surface Activated Bonding Method

2003 · 285 citations

A Study Of The Transient Liquid Phase Bonding Process Applied To A Ag/Cu/Ag Sandwich Joint

1988 · 277 citations

Metallurgy Of Low Temperature Pb-free Solders For Electronic Assembly

1995 · 274 citations

Thermal Stress In Bonded Joints

1979 · 273 citations

Pb-free Solders For Flip-Chip Interconnects

2001 · 272 citations