Tin–lead (SnPb) Solder Reaction In Flip Chip Technology

·2001·DOI
Engineering and Technology
Communication and Signal Processing
Advanced Electronic Packaging Technologies
Thermal Interface Bonding Research

Role in the Field

Neutralin Engineering and Technology
Neutralin Communication and Signal Processing
Neutralin Advanced Electronic Packaging Technologies
Neutralin Thermal Interface Bonding Research

Abstract

Citations

521

Year

2001

PageRank

3.5 / 10

Relative influence (log-scaled)

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