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  3. Kirkendall Void Formation In Eutectic SnPb Solder Joints On Bare Cu And Its Effect On Joint Reliability

Kirkendall Void Formation In Eutectic SnPb Solder Joints On Bare Cu And Its Effect On Joint Reliability

·2005·DOI
Engineering and Technology
Communication and Signal Processing
Reliability and Failure Analysis
Thermal Interface Bonding Research

Role in the Field

Neutralin Engineering and Technology
Neutralin Communication and Signal Processing
Neutralin Reliability and Failure Analysis
Neutralin Thermal Interface Bonding Research

Abstract

Citations

393

Year

2005

PageRank

3.1 / 10

Relative influence (log-scaled)

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