A Study Of The Transient Liquid Phase Bonding Process Applied To A Ag/Cu/Ag Sandwich Joint

·1988·DOI
Engineering and Technology
Materials Science and Physics
Advanced Electronic Packaging Technologies
Thermal Interface Bonding Research

Role in the Field

Neutralin Engineering and Technology
Neutralin Materials Science and Physics
Neutralin Advanced Electronic Packaging Technologies
Neutralin Thermal Interface Bonding Research

Abstract

Citations

277

Year

1988

PageRank

3.6 / 10

Relative influence (log-scaled)

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