Electronic Packaging Material Advancements

This cluster is dedicated to the exploration of new materials and processing methods in electronic packaging. It highlights the shift towards lead-free alternatives and their reliability.

packaging materials
lead-free alternatives
reliability
processing methods
innovation

4,803 papers

Parent topic: Advanced Electronic Packaging Technologies

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Papers Over Time

1960197019801990200020102020

Top Papers

A Review On Hot Stamping

2010 · 1,368 citations

Recent Advances Of Conductive Adhesives As A Lead-Free Alternative In Electronic Packaging: Materials, Processing, Reliability And Applications

2006 · 597 citations

A Review On Die Attach Materials For SiC-Based High-Temperature Power Devices

2010 · 292 citations

Low-temperature Low-Pressure Die Attach With Hybrid Silver Particle Paste

2012 · 250 citations

Smart Packaging: Opportunities And Challenges

2018 · 226 citations

The Effect Of Thermal Contact Resistance On Heat Management In The Electronic Packaging

2005 · 198 citations

Pressureless Bonding Process Using Ag Nanoparticle Paste For Flexible Electronics Packaging

2012 · 191 citations

Recent Advances In Polymer-Based Electronic Packaging Materials

2020 · 157 citations

Review Of Recent Advances In Electrically Conductive Adhesive Materials And Technologies In Electronic Packaging

2008 · 149 citations

Rapid Pressureless Low-Temperature Sintering Of Ag Nanoparticles For High-Power Density Electronic Packaging

2013 · 146 citations

Fabrication And Properties Of Extrusion-Based 3D-printed Hardmetal And Cermet Components

2019 · 140 citations

Advanced Materials For Thermal Management Of Electronic Packaging

2011 · 136 citations

Packaging Design: General Framework And Research Agenda

2012 · 129 citations

Effects Of Carbon Nanotube On The Thermal, Mechanical, And Electrical Properties Of PLA/CNT Printed Parts In The FDM Process

2019 · 127 citations

Via-filling Using Electroplating For Build-Up PCBs

2001 · 106 citations

Survey Of High-Temperature Polymeric Encapsulants For Power Electronics Packaging

2015 · 104 citations

Survey On High-Temperature Packaging Materials For SiC-Based Power Electronics Modules

2007 · 99 citations

Review Of Thermal Packaging Technologies For Automotive Power Electronics For Traction Purposes

2018 · 96 citations

Printed Transistors On Paper: Towards Smart Consumer Product Packaging

2014 · 91 citations

Highly Reliable, Low Cost, Isotropically Conductive Adhesives Filled With Ag-coated Cu Flakes For Electronic Packaging Applications

2010 · 89 citations