Recent Advances Of Conductive Adhesives As A Lead-Free Alternative In Electronic Packaging: Materials, Processing, Reliability And Applications

·2006·DOI
Engineering and Technology
Communication and Signal Processing
Advanced Electronic Packaging Technologies
Electronic Packaging Material Advancements

Role in the Field

Neutralin Engineering and Technology
Neutralin Communication and Signal Processing
Neutralin Advanced Electronic Packaging Technologies
Neutralin Electronic Packaging Material Advancements

Abstract

Citations

597

Year

2006

PageRank

3.1 / 10

Relative influence (log-scaled)

Related Papers

10 of 10 papers

Recent Advances In Polymer-Based Electronic Packaging Materials
·2020·157 citations
Fabrication And Properties Of Extrusion-Based 3D-printed Hardmetal And Cermet Components
·2019·140 citations
Smart Packaging: Opportunities And Challenges
·2018·226 citations
Rapid Pressureless Low-Temperature Sintering Of Ag Nanoparticles For High-Power Density Electronic Packaging
·2013·146 citations
Low-temperature Low-Pressure Die Attach With Hybrid Silver Particle Paste
·2012·250 citations
Pressureless Bonding Process Using Ag Nanoparticle Paste For Flexible Electronics Packaging
·2012·191 citations
A Review On Hot Stamping
·2010·1,368 citations
A Review On Die Attach Materials For SiC-Based High-Temperature Power Devices
·2010·292 citations
Review Of Recent Advances In Electrically Conductive Adhesive Materials And Technologies In Electronic Packaging
·2008·149 citations
The Effect Of Thermal Contact Resistance On Heat Management In The Electronic Packaging
·2005·198 citations