Pressureless Bonding Process Using Ag Nanoparticle Paste For Flexible Electronics Packaging

·2012·DOI

Engineering and Technology

Communication and Signal Processing

Advanced Electronic Packaging Technologies

Electronic Packaging Material Advancements

Role in the Field

Neutralin Engineering and Technology

Neutralin Communication and Signal Processing

Neutralin Advanced Electronic Packaging Technologies

Neutralin Electronic Packaging Material Advancements

Abstract

Citations

191

Year

2012

PageRank

2.2 / 10

Relative influence (log-scaled)