Highly Reliable, Low Cost, Isotropically Conductive Adhesives Filled With Ag-coated Cu Flakes For Electronic Packaging Applications

·2010·DOI
Engineering and Technology
Communication and Signal Processing
Advanced Electronic Packaging Technologies
Electronic Packaging Material Advancements

Role in the Field

Neutralin Engineering and Technology
Neutralin Communication and Signal Processing
Neutralin Advanced Electronic Packaging Technologies
Neutralin Electronic Packaging Material Advancements

Abstract

Citations

89

Year

2010

PageRank

1.3 / 10

Relative influence (log-scaled)

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