Polymer Microfabrication Techniques

Research in this cluster involves techniques for microfabrication using polymers, addressing bonding quality, dielectric materials, and novel joining methods in electronic components.

polymer microfabrication
bonding quality
dielectric materials
joining methods
electronic components

1,857 papers

Parent topic: Advanced Electronic Packaging Technologies

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Papers Over Time

1960197019801990200020102020

Top Papers

Effect Of Processing Conditions On The Bonding Quality Of FDM Polymer Filaments

2008 · 947 citations

Development Of A Low-Dielectric-Constant Polymer For The Fabrication Of Integrated Circuit Interconnect

2000 · 303 citations

Controlled Collapse Reflow Chip Joining

1969 · 284 citations

Design And Fabrication Of Elastic Interconnections For Stretchable Electronic Circuits

2007 · 210 citations

High Fill-Factor Microlens Array Mold Insert Fabrication Using A Thermal Reflow Process

2004 · 141 citations

Fabrication Of SU-8 Multilayer Microstructures Based On Successive CMOS Compatible Adhesive Bonding And Releasing Steps

2005 · 123 citations

Polyimide Insulators For Multilevel Interconnections

1981 · 116 citations

Self-assembling MEMS Variable And Fixed RF Inductors

2001 · 114 citations

A Novel Passive Micromixer: Lamination In A Planar Channel System

2009 · 112 citations

Solder Self-Assembly For Three-Dimensional Microelectromechanical Systems

1999 · 104 citations

Self-assembly For Microscale And Nanoscale Packaging: Steps Toward Self-Packaging

2005 · 99 citations

Injection Molding Of Components For Microsystems

2001 · 88 citations

Microinjection Molding Of Microsystem Components: New Aspects In Improving Performance

2013 · 86 citations

A Family Of Substructure Decoupling Techniques Based On A Dual Assembly Approach

2012 · 86 citations

Modeling And Simulation For Microelectronic Packaging Assembly

2011 · 82 citations

New Three-Dimensional Integration Technology Using Self-Assembly Technique

0 · 79 citations

Design Of Microfabricated Inductors

1999 · 70 citations

Wafer Level Encapsulation Of Microsystems Using Glass Frit Bonding

2005 · 65 citations

Manufacturing Metrology For c-Si Module Reliability And Durability Part III: Module Manufacturing

2016 · 64 citations

Design Of Solder Joints For Self-Aligned Optoelectronic Assemblies

1995 · 63 citations