Wafer Level Encapsulation Of Microsystems Using Glass Frit Bonding

·2005·DOI
Engineering and Technology
Optical Science and Technology
Advanced Electronic Packaging Technologies
Polymer Microfabrication Techniques

Role in the Field

Neutralin Engineering and Technology
Neutralin Optical Science and Technology
Neutralin Advanced Electronic Packaging Technologies
Neutralin Polymer Microfabrication Techniques

Abstract

Citations

65

Year

2005

PageRank

1.4 / 10

Relative influence (log-scaled)

Related Papers

11 of 11 papers

A Novel Passive Micromixer: Lamination In A Planar Channel System
·2009·112 citations
Effect Of Processing Conditions On The Bonding Quality Of FDM Polymer Filaments
·2008·947 citations
Design And Fabrication Of Elastic Interconnections For Stretchable Electronic Circuits
·2007·210 citations
Fabrication Of SU-8 Multilayer Microstructures Based On Successive CMOS Compatible Adhesive Bonding And Releasing Steps
·2005·123 citations
Self-assembly For Microscale And Nanoscale Packaging: Steps Toward Self-Packaging
·2005·99 citations
High Fill-Factor Microlens Array Mold Insert Fabrication Using A Thermal Reflow Process
·2004·141 citations
Self-assembling MEMS Variable And Fixed RF Inductors
·2001·114 citations
Development Of A Low-Dielectric-Constant Polymer For The Fabrication Of Integrated Circuit Interconnect
·2000·303 citations
Solder Self-Assembly For Three-Dimensional Microelectromechanical Systems
·1999·104 citations
Polyimide Insulators For Multilevel Interconnections
·1981·116 citations
Controlled Collapse Reflow Chip Joining
·1969·284 citations