Size Effect And Minimum Chip Thickness In Micromilling

·2015·DOI

Engineering and Technology

Communication and Signal Processing

Nanoelectronics and Sensor Technologies

Microfabrication and Packaging Advances

Role in the Field

Neutralin Engineering and Technology

Neutralin Communication and Signal Processing

Neutralin Nanoelectronics and Sensor Technologies

Neutralin Microfabrication and Packaging Advances

Abstract

Citations

240

Year

2015

PageRank

2.0 / 10

Relative influence (log-scaled)

Related Papers

10 of 10 papers

Residual Stress Of As-Deposited And Rolled Wire+Arc Additive Manufacturing Ti–6Al–4V Components

·2016·177 citations

Causes Of Failure And Repairing Options For Dies And Molds: A Review

·2013·155 citations

3-D Hyperintegration And Packaging Technologies For Micro-Nano Systems

·2009·277 citations

Applying Anand Model To Low-Temperature Sintered Nanoscale Silver Paste Chip Attachment

·2009·154 citations

High Speed MQL Finish-Turning Of Inconel 718 With Different Coated Tools

·2007·232 citations

Micro Total Analysis Systems. Latest Advancements And Trends

·2006·854 citations

Handbook Of Lead-Free Solder Technology For Microelectronic Assemblies

·2004·168 citations

Submicron And Ultrafine Grained Hardmetals For Microdrills And Metal Cutting Inserts

·2002·202 citations

Current Status Of Research And Development For Three-Dimensional Chip Stack Technology

·2001·159 citations

Damascene Copper Electroplating For Chip Interconnections

·1998·1,088 citations