Applying Anand Model To Low-Temperature Sintered Nanoscale Silver Paste Chip Attachment

·2009·DOI

Engineering and Technology

Communication and Signal Processing

Advanced Electronic Packaging Technologies

Microfabrication and Packaging Advances

Role in the Field

Neutralin Engineering and Technology

Neutralin Communication and Signal Processing

Neutralin Advanced Electronic Packaging Technologies

Neutralin Microfabrication and Packaging Advances

Abstract

Citations

154

Year

2009

PageRank

2.2 / 10

Relative influence (log-scaled)

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