Damascene Copper Electroplating For Chip Interconnections

·1998·DOI

Engineering and Technology

Optical Science and Technology

Advanced Electronic Packaging Technologies

Microfabrication and Packaging Advances

Role in the Field

Neutralin Engineering and Technology

Neutralin Optical Science and Technology

Neutralin Advanced Electronic Packaging Technologies

Neutralin Microfabrication and Packaging Advances

Abstract

Citations

1,088

Year

1998

PageRank

3.9 / 10

Relative influence (log-scaled)

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