Packaging Technology For Imager Using Through-Hole Interconnections In Si Substrate

·0·DOI
Engineering and Technology
Optical Science and Technology
Advanced Electronic Packaging Technologies
Wafer Level Packaging Innovations

Role in the Field

Neutralin Engineering and Technology
Neutralin Optical Science and Technology
Neutralin Advanced Electronic Packaging Technologies
Neutralin Wafer Level Packaging Innovations

Abstract

Citations

5

Year

0

PageRank

0.8 / 10

Relative influence (log-scaled)

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