Electromigration In Flip Chip Solder Joints Under Extra High Current Density

·2010·DOI

Engineering and Technology

Communication and Signal Processing

Advanced Electronic Packaging Technologies

Wafer Level Packaging Innovations

Role in the Field

Neutralin Engineering and Technology

Neutralin Communication and Signal Processing

Neutralin Advanced Electronic Packaging Technologies

Neutralin Wafer Level Packaging Innovations

Abstract

Citations

23

Year

2010

PageRank

1.0 / 10

Relative influence (log-scaled)

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