Reliability in Power Packaging

Focusing on the reliability aspects of power electronics packaging, this cluster investigates thermal effects and mechanical properties of materials used in high-temperature applications.

power packaging
reliability
thermal effects
mechanical properties
high-temperature

3,628 papers

Parent topic: Advanced Electronic Packaging Technologies

AI-assisted content · The overview, paper groupings, and influence analysis on this page are AI-generated. They are intended as a starting point for exploring the field and may contain inaccuracies. Report an error

Papers Over Time

1960197019801990200020102020

Top Papers

A Review Of Mechanical Properties Of Lead-Free Solders For Electronic Packaging

2009 · 504 citations

Survey Of High-Temperature Reliability Of Power Electronics Packaging Components

2015 · 296 citations

Thermal Effects In Packaging High Power Light Emitting Diode Arrays

2009 · 265 citations

Failure Modes And FEM Analysis Of Power Electronic Packaging

2002 · 133 citations

Electrically Conductive Adhesives For Surface Mount Solder Replacement

1996 · 120 citations

Polyethylene Under Electrical Stress

2002 · 112 citations

Evaluation Of Vce At Inflection Point For Monitoring Bond Wire Degradation In Discrete Packaged IGBTs

2017 · 104 citations

Design And Optimization Of Thermo-Mechanical Reliability In Wafer Level Packaging

2010 · 91 citations

Electrical Performance Advancement In SiC Power Module Package Design With Kelvin Drain Connection And Low Parasitic Inductance

2019 · 85 citations

Principles Of Electronic Packaging

1989 · 77 citations

Evaluation Of Lead- Free Solder Joints In Electronic Assemblies

1994 · 75 citations

Mechanical Properties Of SnPb And Lead-Free Solders At High Rates Of Strain

2005 · 75 citations

Studies Of The Mechanical And Electrical Properties Of Lead-Free Solder Joints

2002 · 74 citations

Electrical Reliability Of Electrically Conductive Adhesive Joints: Dependence On Curing Condition And Current Density

2001 · 74 citations

A Review Of Recent Developments In Some Practical Aspects Of Air-Cooled Electronic Packages

1998 · 70 citations

PCB Glass-Fibre Laminates: Thermal Conductivity Measurements And Their Effect On Simulation

1990 · 66 citations

Flip-chip Solder Bump Fatigue Life Enhanced By Polymer Encapsulation

0 · 66 citations

Interfacial Versus Cohesive Failure On Polymer-Metal Interfaces In Electronic Packaging—Effects Of Interface Roughness

2002 · 65 citations

Effects Of Electrical Leakage Currents On MEMS Reliability And Performance

2004 · 65 citations

Evaluation Of Encapsulation Materials For High-Temperature Power Device Packaging

2014 · 64 citations