Flip-chip Solder Bump Fatigue Life Enhanced By Polymer Encapsulation

·0·DOI

Engineering and Technology

Communication and Signal Processing

Advanced Electronic Packaging Technologies

Reliability in Power Packaging

Role in the Field

Neutralin Engineering and Technology

Neutralin Communication and Signal Processing

Neutralin Advanced Electronic Packaging Technologies

Neutralin Reliability in Power Packaging

Abstract

Citations

66

Year

0

PageRank

3.3 / 10

Relative influence (log-scaled)

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