Innovations in Electronic Packaging

This cluster explores recent advancements in electronic packaging technologies that enhance the performance and reliability of electronic devices. It covers a range of techniques including soldering and packaging challenges for power modules.

electronic packaging
innovative techniques
reliability
soldering
module packaging

3,846 papers

Parent topic: Advanced Electronic Packaging Technologies

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Papers Over Time

1960197019801990200020102020

Top Papers

Advances In Lead-Free Electronics Soldering

2001 · 655 citations

Measurement And Simulation Of PD In Epoxy Voids

1995 · 315 citations

A Review Of SiC Power Module Packaging Technologies: Challenges, Advances, And Emerging Issues

2020 · 295 citations

Package Parasitic Inductance Extraction And Simulation Model Development For The High-Voltage Cascode GaN HEMT

2014 · 233 citations

A Review Of SiC Power Module Packaging: Layout, Material System And Integration

2017 · 227 citations

Towards Model-Based Engineering Of Optoelectronic Packaging Materials: Dielectric Constant Modeling

2002 · 182 citations

Progress Review Of Electromagnetic Compatibility Analysis Technologies For Packages, Printed Circuit Boards, And Novel Interconnects

2010 · 162 citations

Reliability Issues Of Lead-Free Solder Joints In Electronic Devices

2019 · 159 citations

High-Q LTCC-based Passive Library For Wireless System-On-Package (SOP) Module Development

2001 · 146 citations

A Chip-Scale Packaging Technology For 60-GHz Wireless Chipsets

2006 · 143 citations

Thermal Analysis And Optimization Of Multiple LED Packaging Based On A General Analytical Solution

2010 · 140 citations

Analytical Evaluation Of Via-Plate Capacitance For Multilayer Printed Circuit Boards And Packages

2008 · 129 citations

Die-attachment Solutions For SiC Power Devices

2009 · 124 citations

Modeling And Transient Simulation Of Planes In Electronic Packages

2000 · 114 citations

Automotive Power Module Packaging: Current Status And Future Trends

2020 · 110 citations

Quantifying SMT Decoupling Capacitor Placement In Dc Power-Bus Design For Multilayer PCBs

2001 · 107 citations

Constitutive Behaviour Of Lead-Free Solders Vs. Lead-Containing Solders-Experiments On Bulk Specimens And Flip-Chip Joints

2001 · 102 citations

Organic Packages With Embedded Phased-Array Antennas For 60-GHz Wireless Chipsets

2011 · 94 citations

The Redistributed Chip Package: A Breakthrough For Advanced Packaging

2007 · 89 citations

Impact Of Flip-Chip Packaging On Copper/Low-K Structures

2003 · 88 citations