Constitutive Behaviour Of Lead-Free Solders Vs. Lead-Containing Solders-Experiments On Bulk Specimens And Flip-Chip Joints

·2001·DOI

Engineering and Technology

Engineering and Modeling Sciences

Advanced Electronic Packaging Technologies

Innovations in Electronic Packaging

Abstract

Citations

102

Year

2001

PageRank

2.7 / 10

Relative influence (log-scaled)