Advanced Electronic Packaging Techniques

This research area encompasses modern techniques in electronic packaging, including novel approaches for effective packaging solutions in advanced semiconductor applications.

advanced techniques
electronic packaging
semiconductor applications
novel approaches
innovative solutions

1,318 papers

Parent topic: Advanced Electronic Packaging Technologies

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Papers Over Time

197019801990200020102020

Top Papers

A Solution To Press-Pack Packaging Of SiC MOSFETS

2017 · 81 citations

Packaging Technology For The NEC SX Supercomputer

1985 · 69 citations

Advanced Electronic Packaging

2006 · 69 citations

Surface Laminar Circuit Packaging

0 · 67 citations

Formation And Progression Of Die Soldering During High Pressure Die Casting

2005 · 51 citations

Multisensory Packaging Design

2016 · 48 citations

Influence Of Solder Bump Arrangements On Molded IC Encapsulation

2014 · 33 citations

A Paradigm For Packaging

1997 · 33 citations

Novel Aluminium-Silicon Alloys For Electronics Packaging

1997 · 33 citations

A Catalog Of Techniques For Resolving Packaging Mismatch

1999 · 31 citations

Packaging Technology For IBM's Latest Mainframe Computers (S/390/ES9000)

0 · 31 citations

Panel Level Packaging - A View Along The Process Chain

2018 · 29 citations

Enhanced Lateral Pressure Tuning Of Fiber Bragg Gratings By Polymer Packaging

2004 · 29 citations

Alignment Issues In Packaging For Free-Space Optical Interconnects

1994 · 29 citations

Critical Aspects Of High-Performance Microprocessor Packaging

2003 · 27 citations

An Overview Of Josephson Packaging

1980 · 26 citations

Electronic System Packaging: The Search For Manufacturing The Optimum In A Sea Of Constraints

1990 · 26 citations

Recent Advances In SAW Packaging

0 · 24 citations

Electronic Packaging And Interconnects Series

1998 · 24 citations

Wafer Level Packaging Of Silicon Pressure Sensors

2000 · 24 citations