Influence Of Solder Bump Arrangements On Molded IC Encapsulation

·2014·DOI
Engineering and Technology
Communication and Signal Processing
Advanced Electronic Packaging Technologies
Advanced Electronic Packaging Techniques

Role in the Field

Neutralin Engineering and Technology
Neutralin Communication and Signal Processing
Neutralin Advanced Electronic Packaging Technologies
Neutralin Advanced Electronic Packaging Techniques

Abstract

Citations

33

Year

2014

PageRank

0.9 / 10

Relative influence (log-scaled)

Related Papers

10 of 10 papers

A Solution To Press-Pack Packaging Of SiC MOSFETS
·2017·81 citations
Multisensory Packaging Design
·2016·48 citations
Advanced Electronic Packaging
·2006·69 citations
Formation And Progression Of Die Soldering During High Pressure Die Casting
·2005·51 citations
A Catalog Of Techniques For Resolving Packaging Mismatch
·1999·31 citations
A Paradigm For Packaging
·1997·33 citations
Novel Aluminium-Silicon Alloys For Electronics Packaging
·1997·33 citations
Packaging Technology For The NEC SX Supercomputer
·1985·69 citations
Surface Laminar Circuit Packaging
·0·67 citations
Packaging Technology For IBM's Latest Mainframe Computers (S/390/ES9000)
·0·31 citations