Microelectronics Packaging — An Overview

·1989·DOI
Engineering and Technology
Advanced Electronic Packaging Technologies
Conductive Adhesive Technologies

Role in the Field

Neutralin Engineering and Technology
Neutralin Advanced Electronic Packaging Technologies
Neutralin Conductive Adhesive Technologies

Abstract

Citations

22

Year

1989

PageRank

2.0 / 10

Relative influence (log-scaled)

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