Fabrication Of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies

·2007·DOI
Engineering and Technology
Optical Science and Technology
Advanced Electronic Packaging Technologies
Conductive Adhesive Technologies

Role in the Field

Neutralin Engineering and Technology
Neutralin Optical Science and Technology
Neutralin Advanced Electronic Packaging Technologies
Neutralin Conductive Adhesive Technologies

Abstract

Citations

46

Year

2007

PageRank

1.7 / 10

Relative influence (log-scaled)

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