A New COP Bonding Using Non-Conductive Adhesives For LCDs Driver IC Packaging

·2006·DOI
Engineering and Technology
Communication and Signal Processing
Advanced Electronic Packaging Technologies
Conductive Adhesive Technologies

Role in the Field

Neutralin Engineering and Technology
Neutralin Communication and Signal Processing
Neutralin Advanced Electronic Packaging Technologies
Neutralin Conductive Adhesive Technologies

Abstract

Citations

22

Year

2006

PageRank

1.1 / 10

Relative influence (log-scaled)

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